Schneider Electric 140XBP01600 PLC Backplane – Modicon Quantum
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Key Product Information
Core fields for model confirmation and RFQ routing. Detailed product narrative remains below.
- Brand
- Schneider Electric
- Primary Part Number
- 140XBP01600
- Product Type
- PLC Backplane
- Series / Family
- Modicon Quantum
- Manufacturer
- Schneider Electric (Modicon)
- Country of Origin
- FR
- Catalog Category
- I/O Modules
- Operating Temp.
- 0 °C to +60 °C
- Warranty
- 12 months from date of shipment
Schneider Electric 140XBP01600 — 16-Slot Modicon Quantum Backplane: Structural Role in High-Density I/O Architectures
The 140XBP01600 is a 16-slot passive backplane designed exclusively for the Schneider Electric Modicon Quantum PLC platform. Within a Quantum control rack, the backplane is not a passive carrier in the trivial sense — it is the physical and electrical substrate through which the Quantum I/O bus arbitrates all module-to-CPU data exchange. Each of its 16 module slots presents a standardized 96-pin DIN connector that carries both the parallel backplane bus and the individual module power rails (+5 V logic, +24 V field power). The slot-zero position is reserved for the power supply module, while slots 1 through 15 accept any combination of Quantum-series CPU, communication, discrete I/O, and analog I/O modules without hardware reconfiguration.
In a distributed control architecture, the 140XBP01600 functions as the local rack in a Remote I/O (RIO) or Distributed I/O (DIO) drop. When paired with a Remote I/O Head Adapter (e.g., 140CRA93100), the backplane’s internal bus is bridged to the Quantum RIO coaxial cable network, enabling deterministic scan-cycle data exchange with the primary CPU rack at distances up to 3,000 m. The 16-slot format maximizes I/O density per physical rack, reducing the number of RIO drops required in large-scale process installations and directly lowering cable infrastructure cost.
The mechanical frame is constructed from die-cast aluminum alloy with a powder-coat finish rated for IEC 60068-2-6 sinusoidal vibration (10–57 Hz, 0.075 mm amplitude; 57–150 Hz, 1 g). The rack mounts to standard 35 mm DIN rail or directly to a panel via four M5 bolt positions. Overall dimensions are 482 mm × 177 mm × 130 mm (W × H × D), compatible with 19-inch rack enclosures when the optional rack-mount kit is fitted.
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Technical Parameters
| Parameter | Value |
|---|---|
| Part Number | 140XBP01600 |
| Manufacturer | Schneider Electric (Modicon) |
| Platform | Modicon Quantum |
| Module Slots | 16 (Slot 0: PSU; Slots 1–15: I/O, CPU, Comm) |
| Backplane Bus | Quantum parallel I/O bus, 32-bit data path |
| Slot Connector | 96-pin DIN 41612 Type C (per slot) |
| Logic Supply Voltage | +5 V DC ±5% (from PSU module) |
| Field Power Rail | +24 V DC (distributed via PSU, fused per slot group) |
| Max Bus Current (5 V rail) | Determined by installed PSU module rating |
| Operating Temperature | 0 °C to +60 °C |
| Storage Temperature | −40 °C to +85 °C |
| Relative Humidity | 5% to 95% non-condensing (IEC 60068-2-56) |
| Vibration Resistance | IEC 60068-2-6: 10–150 Hz, 1 g |
| Shock Resistance | IEC 60068-2-27: 15 g, 11 ms half-sine |
| EMC Immunity | IEC 61000-4-2 (ESD), IEC 61000-4-4 (EFT), IEC 61000-4-5 (Surge) |
| Degree of Protection | IP20 (module face); IP00 (rear bus connectors) |
| Mounting | 35 mm DIN rail or panel mount (M5 × 4) |
| Dimensions (W × H × D) | 482 mm × 177 mm × 130 mm |
| Weight | 2,800 g (bare rack, no modules) |
| Country of Origin | France |
| Certifications | CE, UL 508, cUL, RoHS 2011/65/EU |
| IEC Standard | IEC 61131-2 (Programmable Controllers — Equipment Requirements) |
| Warranty | 12 months from date of shipment |
Hardware Logical Analysis
Backplane Bus Architecture: The Quantum backplane implements a 32-bit parallel bus with a dedicated arbitration line per slot. Unlike a shared-bus topology where all modules contend for access simultaneously, the Quantum bus uses a slot-priority arbitration scheme: the CPU module (or RIO head adapter in a remote rack) holds bus mastership and polls each slot in a deterministic round-robin sequence during each PLC scan cycle. This eliminates bus collision latency and guarantees that every module’s I/O data is refreshed within a bounded time window — a prerequisite for process control loops with scan-cycle-sensitive timing requirements.
EMC Design: The die-cast aluminum chassis provides a continuous Faraday enclosure around the backplane PCB traces. All inter-slot signal lines are routed on the inner layers of the backplane PCB, with ground-plane layers on both outer surfaces. The chassis is bonded to the protective earth (PE) terminal via a low-impedance copper braid, ensuring that common-mode noise injected through field wiring is shunted to earth before reaching the logic bus. Schneider Electric specifies the chassis-to-PE bond impedance at <0.1 Ω, which satisfies IEC 61000-4-5 Level 3 surge immunity (2 kV line-to-earth).
Slot Keying and Module Compatibility: Each 96-pin DIN 41612 connector on the backplane incorporates mechanical keying pins that prevent incorrect module insertion. The keying pattern is consistent across all 16 slots, meaning any Quantum-series module can be installed in any slot position (subject to software configuration in Unity Pro / EcoStruxure Control Expert). There is no hardware slot-type restriction, which simplifies spare-parts management in multi-module installations.
Power Distribution: The +5 V logic rail and +24 V field power rail are distributed along the full length of the backplane via dedicated copper bus bars embedded in the PCB stack. Each slot group (typically 4 slots) is protected by a resettable polyfuse on the +24 V rail, isolating field-side faults from propagating to adjacent module groups. The +5 V rail carries no per-slot fusing — module overcurrent protection on the logic side is handled within each individual module’s internal DC-DC converter.
System Integration Benefits
- Maximum I/O density per rack: 15 usable I/O/communication slots in a single 19-inch rack footprint reduce the number of physical enclosures required in large process installations, directly lowering BOM cost and panel wiring labor hours.
- Deterministic scan-cycle refresh: The slot-priority bus arbitration ensures all 15 module slots are polled within a single PLC scan cycle, maintaining data coherency across the entire I/O image table without software-level synchronization overhead.
- Plug-and-play module interchangeability: Any Quantum 140-series module — discrete, analog, counter, or communication — installs into any slot without hardware modification, enabling rapid field reconfiguration and reducing mean time to repair (MTTR) during unplanned maintenance.
- RIO/DIO network integration: When used as a remote rack with a 140CRA93100 or 140CRP93200 head adapter, the 140XBP01600 participates in the Quantum RIO network at up to 1.544 Mbit/s, delivering sub-10 ms I/O update latency over coaxial cable runs up to 3,000 m.
- Hot Standby system compatibility: The backplane is fully compatible with Quantum Hot Standby CPU configurations (e.g., 140CPU67160 pairs). In a Hot Standby topology, the primary and standby CPUs share the same backplane bus, with the standby CPU monitoring bus traffic in listen-only mode and assuming mastership within one scan cycle upon primary failure.
- Diagnostic transparency: Each module slot on the backplane presents a hardware presence bit to the CPU’s I/O image table. A missing or failed module is detected within one scan cycle and reported as a module fault in the Unity Pro / EcoStruxure Control Expert diagnostic buffer, with timestamp and slot address — enabling maintenance personnel to isolate faults without physical rack inspection.
- Grounding and PE compliance: The integrated PE bus bar and chassis bonding point simplify compliance with IEC 60204-1 (Safety of Machinery — Electrical Equipment) grounding requirements. A single M5 PE lug on the rack frame provides the equipotential bonding connection for the entire 16-slot assembly.
- Long-term platform availability: The Modicon Quantum platform has been in continuous production since the mid-1990s and remains supported under Schneider Electric’s long-term availability commitment. The 140XBP01600 backplane is a non-obsolete catalog item, ensuring spare-parts availability for brownfield plant maintenance programs extending 10–15 years into the future.
Quality Assurance & Global Logistics
Every 140XBP01600 unit supplied by siemensplc.com is sourced through verified Schneider Electric authorized distribution channels. Units are inspected against the following acceptance criteria before dispatch: original Schneider Electric factory label with legible date code and traceability markings; 96-pin DIN connectors free of bent, corroded, or missing contacts; chassis continuity between PE lug and all slot connector shield pins (<0.5 Ω); and absence of physical damage to the PCB or aluminum frame.
Logistics operations are based in Xiamen, China — a major export hub with direct access to DHL Express, FedEx International Priority, UPS Worldwide Express, and SF International services. Standard in-stock orders are dispatched within 1–2 business days of payment confirmation. Export documentation — including commercial invoice, packing list, and HS code 8537.10 classification — is prepared in-house. For time-critical plant shutdowns or emergency maintenance scenarios, same-day dispatch is available for orders confirmed before 14:00 CST.
All units ship in anti-static polyethylene foam inserts within double-wall corrugated cartons, meeting ISTA 2A transit testing standards. A 12-month warranty against manufacturing defects is included with every unit. Warranty claims are processed within 5 business days of receipt of the returned unit, with replacement shipment or credit note issued accordingly.
Contact Information
Email: [email protected]
WhatsApp: +86 18359268345
Web: siemensplc.com
Location: Xiamen, China
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