GE IC695ALG626-KF Analog Input Module – PACSystems RX3i

IC695ALG626-KF: 8-Channel Isolated Analog Input Module for GE PACSystems RX3i Control Architecture

The IC695ALG626-KF is a single-slot, 8-channel analog input module engineered for the GE PACSystems RX3i universal backplane. Each channel accepts voltage signals in the ±10 V and 0–10 V ranges, or current signals in the 0–20 mA and 4–20 mA ranges, with per-channel software configuration — eliminating the need for external signal conditioning hardware in mixed-signal field installations. The module delivers 16-bit A/D conversion resolution, yielding a usable dynamic range of 65,536 counts per channel, which translates to a measurement granularity of approximately 0.305 mV at full-scale voltage input. This level of resolution is sufficient for closed-loop PID control of pressure, temperature, flow, and level transmitters operating on standard 4–20 mA HART loops.

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Technical Parameters

Hardware Logical Analysis

The IC695ALG626-KF implements per-channel optical isolation between field-side signal inputs and the RX3i backplane logic bus. Each channel’s analog front-end uses a dedicated sigma-delta A/D converter preceded by a programmable gain amplifier (PGA), which allows the module firmware to select the appropriate input range without requiring physical jumper changes. The optical isolation barrier provides a minimum 500 V DC channel-to-backplane withstand voltage, protecting the CPU and backplane from ground loops and common-mode transients that are endemic in industrial field wiring environments — particularly in installations where signal cables share conduit with motor drive output cables.

The internal 250 Ω shunt resistor for current-mode inputs is precision-trimmed to ±0.05% tolerance, ensuring that the current-to-voltage conversion at the A/D input does not introduce additional gain error beyond the module’s stated ±0.1% full-scale accuracy specification. Open-wire detection on current channels is implemented by monitoring the shunt voltage: when the loop current drops below approximately 1 mA, the module flags the channel as faulted and reports the condition to the RX3i CPU via the backplane diagnostic register, enabling the application program to execute a safe-state substitution value rather than acting on a stale or erroneous process variable.

EMC performance is achieved through a combination of hardware filtering and PCB layout discipline. Each analog input line passes through a passive RC low-pass filter with a cutoff frequency of approximately 10 Hz before reaching the PGA input, attenuating high-frequency conducted interference from variable-frequency drives and switching power supplies. The PCB ground plane is split between the analog and digital domains, with the two planes joined at a single star point adjacent to the isolation barrier — a standard technique for preventing digital switching noise from coupling into the analog measurement path. The module housing is a conductive die-cast frame that bonds to the backplane chassis ground, providing a low-impedance return path for shield currents and reducing radiated susceptibility in environments classified up to IEC 61000-4-3 Level 3.

System Integration Benefits

• Deterministic scan-cycle alignment: The module’s internal scan completes within one RX3i CPU sweep cycle, ensuring that all 8 channel values are coherent and time-stamped to the same program scan — critical for multi-variable ratio control loops where inter-channel skew would introduce steady-state offset errors.
• Per-channel range flexibility: Voltage and current input types can be mixed across the 8 channels without hardware modification, reducing BOM complexity and allowing a single module to serve both transmitter (4–20 mA) and potentiometer (0–10 V) field devices simultaneously.
• Transparent channel diagnostics: Open-wire faults, over-range conditions, and under-range conditions are reported as individual channel status bits in the module’s input data table, accessible directly from the ladder or structured text program without requiring a separate diagnostic function block.
• Hot-swap support: On RX3i backplanes configured for hot-swap operation, the IC695ALG626-KF can be removed and reinserted without powering down the rack, reducing planned maintenance downtime in continuous-process installations where a full shutdown carries significant production cost.
• Proficy Machine Edition integration: The module’s I/O configuration is managed entirely within the PME hardware configuration tree. Channel scaling, engineering unit conversion, and alarm limits are defined at the configuration level and downloaded to the module, offloading these calculations from the CPU application program and reducing scan-time overhead.
• Scalable channel density: A single RX3i universal backplane can accommodate multiple IC695ALG626-KF modules, scaling analog input capacity in 8-channel increments up to the backplane’s slot limit — without requiring a separate analog expansion rack or additional power supply in most configurations.
• Firmware revision traceability: The -KF suffix identifies a specific factory firmware build, enabling maintenance teams to verify module firmware consistency across a multi-rack installation and ensuring that all modules respond identically to the same PME configuration parameters.
• Reduced field wiring cost: The module’s high input impedance on voltage channels (>10 MΩ) allows multiple modules to be connected in parallel across a single transmitter output without loading the source, simplifying redundant monitoring architectures in safety-instrumented systems.

Quality Assurance & Global Logistics

Every IC695ALG626-KF unit shipped from siemensplc.com is sourced through verified industrial supply channels and subjected to a structured pre-shipment inspection protocol. Physical authentication checks include label integrity verification against OEM reference markings, firmware suffix confirmation, connector pin condition inspection, and housing authenticity assessment. Functional validation — where test equipment is available — includes backplane power-up, channel response verification across the full input range, and diagnostic register readback to confirm that the module’s self-test routines complete without fault flags.

Shipments originate from our warehouse in Xiamen, China, a major export hub with direct access to international express carriers. Standard export documentation — commercial invoice, packing list, certificate of origin, and ESD compliance certificate — is prepared for every order. All modules are packed in anti-static ESD shielding bags, placed in foam-lined cartons rated for air freight handling, and sealed with tamper-evident tape. Typical dispatch time for in-stock units is 1–2 business days from order confirmation. International express delivery via DHL, FedEx, or UPS reaches most destinations in Asia, Europe, and North America within 3–7 business days. Bulk orders and project-volume shipments can be consolidated for sea freight with full export licensing support.

A 12-month warranty covers all units against manufacturing defects and functional failure under normal operating conditions. Warranty claims are processed by direct communication with our technical team, who will arrange replacement or repair without requiring the buyer to navigate a third-party RMA system.

Contact Information

Email: [email protected]
WhatsApp: +86 18359268345
Web: siemensplc.com
Location: Xiamen, China
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