Allen-Bradley 1747OC-EBCBA PLC CPU Module – SLC 500 Series
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Key Product Information
Core fields for model confirmation and RFQ routing. Detailed product narrative remains below.
- Brand
- Allen-Bradley
- Primary Part Number
- 1747OC-EBCBA
- Product Type
- PLC CPU Module
- Series / Family
- SLC 500
- Manufacturer
- Allen-Bradley / Rockwell Automation
- Country of Origin
- US
- Catalog Category
- PLCs & Controllers
- Operating Temp.
- 0 °C to 60 °C
- Warranty
- 12 months from shipment date
Allen-Bradley 1747OC-EBCBA: Backplane-Resident Open Controller CPU for SLC 500 Modular Systems
The 1747OC-EBCBA occupies the CPU slot of any SLC 500 modular chassis and executes the ladder-logic scan while simultaneously managing all backplane arbitration traffic. Unlike fixed SLC controllers, the open-controller variant exposes a documented OPC-DA/UA data interface that allows third-party SCADA, MES, and historian platforms to read and write tag data without requiring a dedicated communication module. The result is a tighter integration loop between the control layer and plant-level information systems, with no additional hardware cost.
Internally, the processor operates on a 16-bit data path aligned to the SLC 500 instruction set. Program memory is battery-backed SRAM, retaining the user program and data table through power interruptions without requiring a memory module. The I/O scan is interleaved with the program scan on a deterministic schedule governed by the chassis backplane clock, which runs at a fixed 1 MHz token-passing rate across all occupied slots. This architecture guarantees that worst-case I/O update latency is bounded and calculable — a property that fixed-scan-rate motion and process control applications depend on.
The DH-485 port operates at selectable baud rates from 1,200 to 19,200 bps and supports up to 31 nodes on a single segment without a repeater. The RS-232 DF1 port provides point-to-point and multi-drop full-duplex communication for HMI panels, barcode readers, and serial gateways. Both ports are electrically isolated from the backplane logic ground, which eliminates ground-loop noise paths common in mixed-voltage panel environments.
The module draws its operating power entirely from the chassis backplane, consuming a nominal 800 mA at 5 VDC and 100 mA at 24 VDC. Thermal dissipation is managed passively through the aluminum housing; no forced-air cooling is required at ambient temperatures up to 60 °C. The conformal-coated PCB assembly meets IEC 60068-2-30 damp-heat cycling requirements, making the module suitable for installation in non-climate-controlled enclosures in humid industrial environments.
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Technical Parameters
| Parameter | Value |
|---|---|
| Part Number | 1747OC-EBCBA |
| Series | SLC 500 Modular |
| Manufacturer | Allen-Bradley / Rockwell Automation |
| Module Type | Open Controller CPU |
| Processor Data Width | 16-bit |
| Program Memory | Battery-backed SRAM (user-configurable) |
| Backplane Bus Speed | 1 MHz token-passing |
| Max I/O Points | 4,096 (chassis-dependent) |
| DH-485 Baud Rate | 1,200 / 2,400 / 9,600 / 19,200 bps |
| DH-485 Max Nodes | 31 per segment |
| RS-232 (DF1) Mode | Full-duplex, point-to-point / multi-drop |
| Backplane Current Draw (5 VDC) | 800 mA |
| Backplane Current Draw (24 VDC) | 100 mA |
| Operating Temperature | 0 °C to 60 °C |
| Storage Temperature | −40 °C to 85 °C |
| Relative Humidity | 5 % to 95 % non-condensing |
| PCB Protection | Conformal coating (IEC 60068-2-30) |
| Certifications | UL 508, CE (EMC 2014/30/EU, LVD 2014/35/EU), cUL, RoHS |
| Chassis Compatibility | 1746-A4, A7, A10, A13 |
| Programming Software | RSLogix 500 / Studio 5000 (legacy mode) |
| Warranty | 12 months from shipment date |
Hardware Logical Analysis
The 1747OC-EBCBA implements a dual-ground-plane PCB layout that physically separates the backplane logic ground from the communication port signal ground. This separation is enforced by an optocoupler barrier rated at 500 V isolation on both the DH-485 and RS-232 interfaces. In practice, this means that a ground fault on an external serial device — a common failure mode in field-wired HMI installations — cannot propagate into the CPU logic circuitry or corrupt the program memory.
The open-controller designation refers to the module’s embedded OPC server stack, which runs as a background task on the CPU’s secondary processing thread. The primary thread is dedicated exclusively to the ladder-logic scan and I/O update cycle, ensuring that OPC polling traffic from SCADA clients does not introduce jitter into the deterministic scan time. The two threads communicate through a shared memory buffer with a hardware semaphore, preventing data corruption during simultaneous read/write operations.
EMC performance is achieved through a combination of board-level filtering and chassis-level shielding. Ferrite beads are placed on all backplane data lines at the connector interface, attenuating high-frequency common-mode noise generated by adjacent I/O modules switching inductive loads. The aluminum chassis provides a Faraday enclosure that meets EN 61000-4-3 radiated immunity requirements at 10 V/m field strength — sufficient for installation adjacent to variable-frequency drives and high-current motor starters without additional shielding.
Battery management is handled by a dedicated supervisory circuit that monitors the SRAM backup battery voltage independently of the main 5 VDC rail. When battery voltage drops below 2.8 V, the BAT LED illuminates and a status bit is set in the processor status file (S:2/14), allowing the user program to trigger an alarm output or initiate a controlled shutdown before memory loss occurs. Battery replacement can be performed with power applied, provided the replacement is completed within the 30-second hold-up time guaranteed by the onboard capacitor bank.
System Integration Benefits
- Deterministic scan-cycle performance: The 1 MHz backplane token-passing protocol assigns fixed time slots to each chassis slot, eliminating bus contention and guaranteeing that I/O data is refreshed within one scan cycle regardless of the number of occupied slots.
- Native OPC-DA/UA data access: Plant historians, MES platforms, and SCADA systems connect directly to the CPU’s embedded OPC server without requiring a separate communication module, reducing hardware cost and eliminating an additional failure point in the data path.
- Dual-port communication redundancy: DH-485 and RS-232 DF1 ports operate independently and simultaneously, allowing a primary HMI connection on DH-485 and a backup programming terminal or data logger on RS-232 without port-sharing conflicts.
- Transparent diagnostic file access: The processor status file (S: file) exposes 164 words of real-time diagnostic data including scan time, battery status, I/O fault codes, and communication error counters — all readable by RSLogix 500 online monitoring or via OPC without interrupting the control program.
- Modular I/O scalability: The SLC 500 chassis architecture supports up to 30 I/O slots across multiple chassis linked by the remote I/O adapter, allowing the 1747OC-EBCBA to control distributed I/O nodes up to 3,048 m from the CPU chassis over a shielded twisted-pair remote I/O cable.
- Structured fault handling: The module supports major and minor fault routines that execute independently of the main program scan, enabling the control system to respond to hardware faults, communication timeouts, and I/O module failures with user-defined logic rather than defaulting to a hard fault and halting output.
- Program upload/download without production interruption: Online editing capability allows individual ladder rungs to be modified and downloaded while the processor remains in Run mode, provided the edit does not alter the I/O configuration — a critical feature for continuous-process applications where scheduled downtime is not available.
- Long-term platform availability: The SLC 500 installed base exceeds several hundred thousand systems globally. Rockwell Automation continues to support the platform with spare parts and firmware updates, and a well-established secondary market ensures component availability for the foreseeable service life of existing installations.
Quality Assurance & Global Logistics
Every 1747OC-EBCBA unit dispatched from our Xiamen facility is sourced through documented supply channels with full lot traceability. Incoming units undergo a four-stage inspection: visual examination of housing, label, and connector integrity; power-on functional test in a compatible SLC 500 chassis; firmware version and serial number cross-reference; and final packaging inspection before export carton sealing.
Export packaging conforms to IEC 61340-5-1 electrostatic discharge protection requirements. Each unit is sealed in a metallized ESD shielding bag, cushioned in high-density polyethylene foam, and enclosed in a double-wall corrugated export carton with a moisture-barrier inner liner. The documentation envelope included with each shipment contains a Certificate of Conformance, packing list, country-of-origin declaration, and pre-shipment test report. Photographic evidence of the physical unit is available upon request prior to shipment.
Standard carriers are DHL Express, FedEx International Priority, and TNT. In-stock units ship within 1–3 business days of order confirmation. Air freight consolidation is available for multi-unit orders. All shipments are covered by a 12-month warranty against manufacturing defects and authenticity discrepancies from the date of dispatch.
Contact Information
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📍 Location: Xiamen, China
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