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Fuji Electric 2MBI200J-140 IGBT Power Module – J-Series

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Key Product Information

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Brand
Fuji Electric
Primary Part Number
2MBI200J-140
Product Type
IGBT Power Module
Product Family
Other series
Manufacturer
Fuji Electric Co., Ltd. — Japan
Country of Origin
Japan
Catalog Category
Motor Drives
Warranty
12 months against manufacturing defects under rated operating conditions
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Product Overview

Fuji Electric 2MBI200J-140 — 200 A / 1400 V Half-Bridge IGBT Module for High-Power Industrial Converters

The 2MBI200J-140 occupies the upper tier of Fuji Electric’s J-Series dual-pack IGBT platform, delivering a 200 A continuous collector current against a 1400 V collector-emitter blocking voltage. Within a three-phase inverter topology, three of these modules form a complete six-switch bridge capable of driving AC induction or permanent-magnet motors up to approximately 132 kW at 690 V AC — without paralleling. The half-bridge (dual-pack) configuration integrates two discrete IGBT chips and two anti-parallel freewheeling diodes in a single thermally optimized baseplate package, reducing interconnect inductance and simplifying gate-drive PCB layout compared to discrete-device assemblies.

This module is stocked at our Xiamen, China facility and ships globally via DHL / FedEx express. Each unit is individually inspected against Fuji Electric’s original date-code and part-marking standards before dispatch.

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Technical Parameters

Parameter Value / Condition
Part Number 2MBI200J-140
Manufacturer Fuji Electric Co., Ltd. — Japan
Module Topology Half-Bridge (Dual-Pack, 2-in-1)
Collector Current — DC (IC) 200 A
Collector Current — Pulsed (ICM) 400 A (tp ≤ 1 ms)
Collector-Emitter Voltage (VCES) 1400 V
Gate-Emitter Voltage (VGES) ±20 V (absolute maximum)
Saturation Voltage VCE(sat) ≤ 2.5 V @ IC = 200 A, VGE = +15 V, Tj = 25°C
Freewheeling Diode Forward Voltage (VF) ≤ 2.7 V @ IF = 200 A, Tj = 25°C
Switching Frequency Up to 20 kHz (application-dependent; derate above 10 kHz)
Turn-On Switching Loss (Eon) Refer to Fuji Electric datasheet Fig. 8
Turn-Off Switching Loss (Eoff) Refer to Fuji Electric datasheet Fig. 9
Junction Temperature — Operating (Tj) −40°C to +150°C
Storage Temperature (Tstg) −40°C to +125°C
Thermal Resistance — Junction to Case (Rth(j-c)) per IGBT ≤ 0.10 °C/W (typical; see datasheet)
Isolation Voltage (Visol) 2500 V AC, 1 min (baseplate to terminals)
Package Style Fuji Standard Module — screw-terminal baseplate
Approximate Weight 1800 g
RoHS Status Compliant
Warranty 12 months against manufacturing defects under rated operating conditions
Country of Origin Japan

Hardware Logical Analysis

Direct Copper Bonding (DCB) Substrate Architecture
The 2MBI200J-140 uses a DCB ceramic substrate — typically Al₂O₃ or AlN — bonded directly to the copper baseplate. This eliminates the solder layer between the ceramic and the copper heat spreader, reducing the junction-to-case thermal resistance to values below 0.10 °C/W per switch. At 200 A continuous load, even a 0.02 °C/W improvement in Rth(j-c) translates to a 4°C reduction in junction temperature at 200 W conduction loss per chip — a meaningful margin when operating near the 150°C Tj ceiling.

Soft-Recovery Anti-Parallel Diode Design
The integrated freewheeling diodes are engineered with a controlled reverse-recovery charge (Qrr) profile. A hard-recovery diode generates a high di/dt spike during commutation, exciting parasitic inductance in the DC bus and producing voltage overshoot that can exceed VCES. The J-Series diodes suppress this by extending the recovery tail, keeping peak reverse current and the resulting Lbus × (di/dt) spike within the module’s safe operating area (SOA) at switching frequencies up to 10 kHz without external snubbers in well-designed layouts.

EMC and Stray Inductance Management
The screw-terminal baseplate package of the 2MBI200J-140 is designed with co-planar positive and negative DC bus terminals positioned to allow laminated busbar connection. A laminated busbar reduces stray inductance (Lstray) from a typical wire-harness value of 100–200 nH down to 10–30 nH. At a turn-off di/dt of 1000 A/µs and Lstray = 20 nH, the resulting overvoltage spike is only 20 V — negligible against the 1400 V VCES rating. This geometry is a deliberate hardware-level EMC mitigation, not a software-configurable parameter.

Gate Charge and Drive Impedance
The IGBT gate capacitance (Cies) at this current class is typically 30–50 nF. A gate resistor (Rg) in the range of 10–33 Ω controls the gate charge/discharge rate, setting the trade-off between switching loss (lower Rg = faster switching = lower Eon/Eoff) and EMI / overvoltage (higher Rg = slower dV/dt = lower EMI). The J-Series chip geometry is optimized for a recommended Rg of 15–22 Ω at 10 kHz, balancing efficiency and conducted emissions within CISPR 11 Class A limits for industrial environments.

Short-Circuit Withstand Capability
The 2MBI200J-140 is rated for a short-circuit withstand time (tsc) of 10 µs at VCC = 900 V, Tj = 125°C. This parameter defines the window within which the gate driver’s desaturation (DESAT) protection circuit must detect the fault and suppress the gate signal. A 10 µs tsc is consistent with J-Series design targets and is sufficient for DESAT circuits with propagation delays below 3 µs — a standard specification for dedicated IGBT driver ICs such as the Concept 2SD315A or Semikron SKYPER 32.

System Integration Benefits

  • Reduced Phase-Leg Inductance: The dual-pack configuration places both high-side and low-side switches in a single package, shortening the commutation loop and reducing phase-leg stray inductance by 40–60% versus two discrete single-switch modules wired externally.
  • Simplified Thermal Management: A single baseplate contact surface per phase leg means one heatsink mounting interface, one thermal compound application, and one torque specification — reducing assembly variability and improving thermal reproducibility across production units.
  • Deterministic Gate Drive Timing: Matched IGBT chips within the same module exhibit tighter Vth and VCE(sat) distributions than chips sourced from separate production lots, improving dead-time optimization accuracy and reducing the risk of shoot-through at high switching frequencies.
  • 1400 V Voltage Headroom for 690 V AC Systems: The DC bus voltage in a 690 V AC drive is approximately 975 V (690 × √2). The 1400 V VCES provides a 43% voltage margin above the nominal DC bus — adequate for transient overvoltages without requiring external clamping circuits in most applications.
  • Wide Switching Frequency Range: Qualified operation from fundamental frequency (50/60 Hz) up to 20 kHz enables use in both low-frequency high-power drives and high-frequency resonant converter topologies within the same module family.
  • Integrated Freewheeling Diodes Eliminate External Components: Anti-parallel diodes are co-packaged with the IGBTs, removing the need for external fast-recovery diodes, reducing BOM count, and eliminating the parasitic inductance of external diode interconnects.
  • Standardized Footprint for Multi-Vendor Compatibility: The Fuji Standard Module package dimensions are widely adopted, allowing the 2MBI200J-140 to serve as a form-fit-function replacement for equivalent modules from other J-Series variants in existing drive platforms without PCB redesign.
  • Diagnostic Transparency via VCE(sat) Monitoring: The low and stable VCE(sat) characteristic of the J-Series IGBT enables real-time condition monitoring through collector-emitter voltage sensing. A measurable increase in VCE(sat) under constant load current is an early indicator of bond-wire degradation or thermal interface deterioration — supporting predictive maintenance strategies in critical industrial installations.

Quality Assurance & Global Logistics

Every 2MBI200J-140 unit dispatched from our Xiamen warehouse is sourced from Fuji Electric’s authorized distribution network or verified OEM surplus channels. Pre-shipment inspection covers four checkpoints: (1) visual examination of the baseplate, terminal screws, and module housing for mechanical damage; (2) date-code and lot-number verification against Fuji Electric’s part-marking conventions; (3) holographic label and laser-etched SKU authentication; and (4) continuity and isolation screening to confirm the 2500 V AC isolation specification has not been compromised during storage or transit.

Lot numbers and date codes are recorded per shipment and available upon request for incoming quality control audits. Packaging follows anti-static and moisture-barrier protocols: each module is placed in an ESD bag, cushioned with foam inserts rated for the 1800 g module weight, and enclosed in a double-wall corrugated carton. For air freight, cartons are labeled with IATA-compliant electrostatic-sensitive device markings.

Standard export documentation — commercial invoice, packing list, and certificate of origin — is prepared for every international shipment. DHL and FedEx express services from Xiamen typically achieve delivery in 3–5 business days to Europe, North America, and Southeast Asia. Sea freight consolidation is available for bulk orders of 10+ units. All shipments are fully insured and tracked from dispatch to delivery confirmation.

The 12-month warranty covers manufacturing defects under rated operating conditions as specified in the Fuji Electric datasheet. Warranty claims are processed with a target response time of 48 business hours from receipt of the defective unit and supporting documentation.

Contact Information

Email: [email protected]
WhatsApp: +86 18359268345
Web: siemensplc.com
Location: Xiamen, China
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