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FUJI FTM100B PLC Output Module – MICREX-F Series

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Key Product Information

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Brand
Fuji Electric
Primary Part Number
MICREX-F
Product Type
PLC Output Module
Product Family
Other series
Manufacturer
FUJI Electric Co., Ltd.
Country of Origin
JP
Catalog Category
I/O Modules
Operating Temp.
0°C to +55°C (panel-mounted, forced-air cooling recommended above 45°C)
Warranty
12 months from date of shipment
Model confirmed for inquiry MICREX-F Send quantity, destination and urgency. The RFQ form keeps this part number attached.
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Product Overview

FUJI FTM100B – Transistor Output Module for MICREX-F PLC Control Architectures

The FUJI FTM100B is a discrete transistor output module engineered for deployment within FUJI Electric’s MICREX-F programmable logic controller platform. In a distributed I/O architecture, this module occupies the output stage of the control loop: it receives resolved logic states from the CPU over the proprietary MICREX-F backplane bus and drives field-side actuators — solenoid valves, motor contactors, indicator lamps, and relay coils — with deterministic switching latency. Unlike relay output modules, the FTM100B’s solid-state transistor output stage eliminates mechanical wear, enabling sustained high-cycle operation without contact degradation. This characteristic makes it the preferred output interface in applications where output switching frequency exceeds several hundred cycles per hour or where output response time is a process-critical parameter.

Within the MICREX-F system hierarchy, the FTM100B communicates with the CPU module via the internal I/O bus embedded in the backplane. The CPU scans the output image table at each PLC scan cycle — typically in the range of 1–10 ms depending on program size — and writes resolved output states to the module’s internal latch register. The FTM100B then drives its transistor output drivers accordingly, with propagation delay from latch write to physical output state change measured in microseconds. This tight coupling between CPU scan and physical output actuation is fundamental to achieving deterministic control loop closure in time-sensitive manufacturing processes.

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Technical Parameters

Parameter Specification
Manufacturer FUJI Electric Co., Ltd.
Part Number / SKU FTM100B
Series MICREX-F
Module Category Digital Output Module
Output Technology Transistor (solid-state, NPN/PNP — verify per datasheet revision)
Mounting Interface MICREX-F backplane rack slot
Bus Interface FUJI MICREX-F internal I/O bus (proprietary parallel backplane)
Unit Weight 4,460 g (4.46 kg)
Operating Temperature 0°C to +55°C (panel-mounted, forced-air cooling recommended above 45°C)
Storage Temperature -20°C to +70°C
Relative Humidity 5% to 95% RH, non-condensing
Vibration Resistance Compliant with IEC 60068-2-6 (10–57 Hz, 0.075 mm amplitude)
Dielectric Isolation Optical isolation between field-side outputs and logic-side bus (photocoupler-based)
Warranty 12 months from date of shipment

Hardware Logical Analysis

The FTM100B’s output stage is built around a photocoupler-based galvanic isolation barrier positioned between the MICREX-F backplane logic domain (typically 5 VDC CMOS-level signals) and the field-side output domain (24 VDC load circuits). Each output channel routes through an individual LED-photodetector pair, ensuring that transient overvoltages, ground potential differences, and inductive kickback events on the field side cannot propagate into the CPU’s logic circuitry. This isolation architecture is consistent with IEC 61131-2 requirements for Type 1 and Type 3 digital output modules.

On the field side, each transistor driver incorporates a freewheeling diode or transient voltage suppressor (TVS) across the output terminals to clamp inductive load switching transients. When driving inductive loads such as solenoid coils or contactor coils, the energy stored in the load inductance (E = ½LI²) must be dissipated at turn-off; without clamping, the resulting voltage spike can exceed the transistor’s collector-emitter breakdown voltage (BVCEO). The integrated suppression network limits this transient to within the transistor’s safe operating area (SOA), extending output channel service life in inductive-load-intensive applications.

The module’s EMC design addresses both conducted and radiated interference. Conducted immunity is achieved through decoupling capacitors on the logic supply rails and common-mode chokes on the field-side wiring interface. Radiated immunity is supported by the module’s metal housing, which provides a Faraday shield effect, attenuating external RF fields that could otherwise induce spurious switching in high-impedance signal nodes. These design measures align with EN 61000-4-3 (radiated immunity) and EN 61000-4-4 (electrical fast transient/burst) test standards applicable to industrial control equipment.

The backplane bus interface logic within the FTM100B includes address decoding circuitry that maps the module to a specific I/O address range within the MICREX-F system’s I/O memory map. This addressing is established at rack configuration time and is fixed in hardware via slot position, eliminating the risk of address conflicts during hot-swap or module replacement operations — a critical reliability feature in production environments where unplanned downtime carries direct financial cost.

System Integration Benefits

  • Deterministic scan-to-output latency: The FTM100B’s latch-register architecture ensures that CPU output image writes are reflected at the physical output terminals within a single backplane bus cycle, supporting closed-loop control applications with sub-10 ms total loop latency requirements.
  • Per-channel optical isolation: Individual photocoupler isolation on each output channel prevents cross-channel interference and limits fault propagation — a single field-side short circuit affects only the faulted channel, not adjacent outputs or the CPU logic domain.
  • Inductive load compatibility: Integrated transient suppression on each output channel allows direct connection to solenoid valves, motor starters, and relay coils without external flyback diodes, reducing panel wiring complexity and BOM cost.
  • Zero mechanical wear: Solid-state transistor switching eliminates the contact bounce, arc erosion, and mechanical fatigue inherent in relay output modules, supporting sustained operation at switching frequencies that would degrade relay contacts within months.
  • Native MICREX-F bus compatibility: Hardware-level backplane protocol compliance ensures full interoperability with all MICREX-F CPU variants (F70, F80, F120, F140 series) without firmware patches or configuration workarounds.
  • Diagnostic transparency: Output status is reflected in the CPU’s I/O image table in real time, enabling ladder logic or function block programs to implement output verification routines — comparing commanded state against feedback signals to detect field-side wiring faults or actuator failures.
  • Thermal stability across industrial ambient range: Rated operation from 0°C to +55°C covers the full range of enclosed panel environments in manufacturing facilities, including those without active climate control in non-critical areas.
  • Simplified spare parts management: A single FTM100B part number covers the complete output channel set, reducing spare parts inventory complexity and ensuring that maintenance personnel can execute module replacement without consulting wiring diagrams for channel-level compatibility.
  • Slot-position address assignment: Hardware-based I/O addressing eliminates software reconfiguration after module replacement, reducing mean time to repair (MTTR) in fault scenarios.
  • Compliance with IEC 61131-2: Electrical characteristics conform to the international standard for PLC peripheral equipment, supporting integration into systems subject to CE marking or equivalent regional certification requirements.

Quality Assurance & Global Logistics

Every FUJI FTM100B unit dispatched from our Xiamen, China facility is sourced directly from authorized FUJI Electric distribution channels. Prior to shipment, each module undergoes a structured inspection protocol: visual examination of PCB, connector pins, housing, and label authenticity; functional output channel continuity verification; and serial number cross-referencing against FUJI Electric’s known genuine product characteristics to screen for counterfeit units — a documented risk in the secondary industrial components market.

Packaging follows anti-static and moisture-barrier standards: each module is sealed in an ESD-protective bag, placed in foam-lined rigid packaging, and enclosed in a double-wall corrugated outer carton rated for international air and sea freight handling. For time-critical requirements, DHL Express, FedEx International Priority, and UPS Worldwide Express services are available from Xiamen Gaoqi International Airport, with transit times of 3–5 business days to most destinations in Europe, North America, Southeast Asia, and the Middle East. Sea freight consolidation is available for bulk orders where lead time permits.

All shipments are accompanied by a commercial invoice, packing list, and certificate of conformity. An inspection report is available on request for customers with incoming quality control requirements. The 12-month warranty covers manufacturing defects and functional failure under normal operating conditions; warranty claims are processed with replacement dispatch within 5 business days of fault confirmation.

Contact Information

Email: [email protected]
WhatsApp: +86 18359268345
Web: siemensplc.com
Location: Xiamen, China
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