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Applied Materials HEA-0200-76057 Semiconductor Process Ring

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Key Product Information

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Brand
Applied Materials
Primary Part Number
HEA-0200-76057
Product Type
Semiconductor Process Ring
Product Family
Other series
Manufacturer
Applied Materials
Country of Origin
US
Catalog Category
Industrial Automation Spares
Model confirmed for inquiry HEA-0200-76057 Send quantity, destination and urgency. The RFQ form keeps this part number attached.
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Product Overview

HEA-0200-76057 Process Ring: Stop the Clock on Your Chamber Downtime — Ships Today

Every hour your CVD or etch chamber sits idle costs real money. A worn or cracked process ring is one of the most common causes of unplanned PM-cycle interruptions, and sourcing the right part fast is the difference between a 4-hour recovery and a 4-day production loss. The Applied Materials HEA-0200-76057 process ring is stocked and ready to ship from Xiamen. No waiting on factory lead times. No chasing distributors. You call, we ship.

This ring is a direct-fit consumable for Applied Materials B101 Series CVD and etch platforms. It cross-references to CAT-530-21G7/VA-214, DV525201, and AQ8965 — all pointing to the same chamber ring geometry. Whether your BOM lists it by the primary part number or a legacy vendor reference, this is the part you need.

URGENT REQUIREMENT? Contact: [email protected] | WhatsApp: +86 18359268345

Quick Technical Datasheet

Parameter Value
Part Number HEA-0200-76057
Cross Reference CAT-530-21G7/VA-214 | DV525201 | AQ8965
Manufacturer Applied Materials
Platform B101 Series (CVD / Etch)
Component Type Process Ring / Chamber Consumable
Material High-purity ceramic / quartz / anodized aluminum (process-dependent)
Weight 360 g
Wafer Compatibility 200mm / 300mm (confirm with chamber config)
Condition New OEM / Refurbished (specify at inquiry)
Country of Origin United States
Stock Status ✅ Ready to Ship — Xiamen Warehouse
Lead Time Same-day dispatch for in-stock units

Troubleshooting & Replacement Tips

Field experience shows the HEA-0200-76057 ring fails in predictable patterns. Knowing what to look for cuts your diagnostic time in half.

Common Failure Indicators:

  • Process drift / yield drop: If your deposition uniformity or etch rate suddenly shifts without a recipe change, inspect the ring first. Micro-cracks or edge chipping alter gas flow paths and plasma confinement geometry — the chamber will still run, but your wafers won’t pass spec.
  • Particle counts spiking: A degraded ring surface sheds material. If your in-situ particle monitor or post-process inspection shows elevated counts localized near the ring zone, it’s time to swap.
  • Arcing events: Ceramic rings with subsurface damage can trigger RF arcing. If you’re seeing intermittent arc faults that don’t correlate with recipe parameters, pull the ring and inspect under UV light for hairline fractures.
  • Abnormal chamber seasoning behavior: If the chamber takes significantly longer to stabilize after a wet clean, the ring surface may be compromised and absorbing moisture or contaminants differently than a fresh part.

Replacement Procedure Notes:

  • Vent the chamber fully and allow cool-down to below 40°C before ring removal. Thermal shock on a hot ring accelerates cracking during handling.
  • Use cleanroom-compatible gloves — skin oils on a ceramic ring surface will cause localized contamination during the next process run.
  • Inspect the ring seat / ledge for debris or deposition buildup before installing the new ring. A contaminated seat will cause the new ring to sit off-plane, recreating the same process drift you just fixed.
  • Torque the retaining hardware to OEM spec — over-torquing ceramic rings is a common field mistake that causes immediate micro-cracking.
  • Run a standard chamber conditioning / seasoning recipe before returning to production wafers. Minimum 3 seasoning wafers recommended after ring replacement.
  • Log the replacement in your PM tracker with the new part serial/lot number for traceability.

Cross-Reference Verification: If your documentation lists DV525201 or AQ8965, confirm the ring OD, ID, and thickness against your chamber drawing before installation. These cross-references are validated for standard B101 configurations, but custom chamber builds may have dimensional variants.

Reliability in Harsh Conditions

Semiconductor process environments are among the most demanding in any industry. The HEA-0200-76057 is engineered to perform where lesser consumables fail.

CVD and etch chambers subject process rings to a brutal combination of stressors: rapid thermal cycling between ambient and process temperatures exceeding 400°C, corrosive process chemistries including fluorine-based etchants, sustained RF plasma exposure, and mechanical stress from repeated chamber cycling. A ring that can’t handle this environment becomes a liability — not a consumable.

The HEA-0200-76057 uses high-purity base materials selected for low outgassing rates, chemical resistance to halogen-based process gases, and dimensional stability across the full operating temperature range. The surface finish is controlled to minimize particle generation during plasma exposure. These aren’t marketing claims — they’re the same material and dimensional specifications that Applied Materials built into the original chamber design.

For fabs operating in high-humidity environments or coastal locations, proper storage matters as much as the part itself. We ship all ceramic and quartz rings in sealed, moisture-barrier packaging with desiccant. Parts stored correctly maintain their surface integrity until the moment you open the bag at the chamber.

Global Express Logistics

Our Xiamen warehouse is positioned for fast international dispatch. Here’s exactly how your order moves:

  • Order confirmation: Within 2 hours of payment or PO receipt during business hours (CST). Stock availability confirmed at time of order.
  • Packing: Parts are inspected, photographed, and packed in ESD-safe, cleanroom-compatible packaging. Fragile ceramic components receive double-wall carton protection with foam inserts.
  • Dispatch: Same-day shipping for orders confirmed before 14:00 CST. DHL Express and FedEx International Priority are our primary carriers for semiconductor components.
  • Transit times: Southeast Asia 1–2 days | Japan / Korea 2–3 days | Europe 3–5 days | North America 3–5 days | Middle East / India 3–4 days.
  • Documentation: Commercial invoice, packing list, certificate of conformance, and HS code declaration included with every shipment. ECCN classification reviewed for export-controlled destinations.
  • Tracking: AWB number provided within 1 hour of dispatch. Real-time tracking link sent directly to your email.
  • Customs support: Our logistics team handles customs documentation for major import markets. For destinations with specific import requirements, contact us before ordering so we can prepare the correct paperwork in advance.

If your situation is genuinely urgent — chamber down, production stopped — tell us when you contact us. We prioritize emergency orders and can coordinate weekend dispatch when needed.

Contact Information

Email: [email protected]
WhatsApp: +86 18359268345
Web: siemensplc.com
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01Model confirmation

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02Availability reply

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03Packing & courier

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