ABB BCCON-23 10000110155 PCB Communication Card – AC800M Series

ABB BCCON-23 (10000110155) — Backplane Communication Interface Card for AC800M and Advant Controller Architectures

The ABB BCCON-23, carrying internal part number 10000110155, is a dedicated backplane communication PCB card engineered for deployment within ABB’s AC800M controller family and the legacy Advant Master series. Its primary function is to arbitrate and relay inter-module data traffic across the S800 I/O bus, providing a deterministic, low-latency communication path between the CPU module and distributed I/O stations. In process-critical environments — refinery control loops, power plant turbine governors, chemical batch reactors — the integrity of this communication layer directly governs scan-cycle fidelity and alarm response latency. The BCCON-23 addresses this requirement through a hardware-level bus controller architecture that operates independently of the CPU’s application processor, ensuring that I/O polling continues uninterrupted even during CPU task-scheduler peaks.

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Technical Parameters

Hardware Logical Analysis

The BCCON-23 implements a split-bus architecture in which the backplane communication controller (BCC) ASIC operates on a dedicated clock domain, fully decoupled from the main CPU application bus. This design choice eliminates the jitter introduced by shared-bus arbitration schemes common in earlier-generation I/O interface cards. The BCC ASIC handles token-passing and frame assembly autonomously, presenting a pre-validated data frame to the CPU’s dual-port RAM interface only after CRC verification — a mechanism that prevents corrupted telegrams from propagating into the controller’s process image.

The optical isolation stage on the bus transceiver uses high-speed optocouplers rated at propagation delays below 50 ns, preserving signal timing integrity across the isolation barrier without introducing measurable latency into the 1 ms scan cycle. This is particularly relevant in fast-loop applications such as turbine speed control, where inter-module communication delays exceeding 200 µs can cause governor instability.

EMC hardening on the BCCON-23 is achieved through a multi-layer PCB stackup with dedicated ground planes on layers 2 and 5, ferrite bead filtering on all power rails entering the card, and transient voltage suppression (TVS) diodes on the backplane connector pins. The card meets EN 61000-4-4 (EFT/Burst, 2 kV) and EN 61000-4-5 (Surge, 1 kV/2 kV) without performance degradation, making it suitable for installation in switchgear rooms where high-energy transients are routine.

The watchdog circuit on the BCCON-23 operates independently of the main firmware execution path. If the communication firmware enters an unresponsive state — detectable within a 50 ms window — the watchdog asserts a hardware reset to the BCC ASIC and logs a fault event to the controller’s diagnostic buffer. This self-recovery mechanism reduces unplanned downtime without requiring operator intervention for transient firmware faults.

System Integration Benefits

• Deterministic scan-cycle preservation: The autonomous BCC ASIC maintains a fixed I/O polling interval regardless of CPU application load, ensuring process variable updates arrive at the controller’s process image within a bounded time window — critical for PID loop stability in temperature and pressure control applications.
• Hot-swap compatibility: The BCCON-23 supports live insertion and removal in AC800M racks equipped with the appropriate power sequencing hardware, enabling module replacement without process shutdown — a measurable reduction in maintenance-window duration for continuous-process plants.
• Transparent fault diagnostics: Three onboard LED indicators provide immediate visual status without requiring a connected engineering workstation. The FAULT LED distinguishes between communication loss (slow blink) and hardware fault (steady), accelerating first-response triage by maintenance personnel.
• Redundancy arbitration support: In dual-CPU redundancy configurations, the BCCON-23 participates in the bumpless transfer handshake protocol, forwarding the active/standby status signal to the I/O bus within one scan cycle of a switchover event, preventing I/O freeze during CPU failover.
• Firmware version independence: The card’s BCC ASIC firmware is stored in on-board flash and is not dependent on the CPU module’s firmware revision for basic bus communication, simplifying mixed-revision system maintenance during phased upgrade projects.
• Reduced wiring complexity: By consolidating backplane communication onto a single card with a standardized DIN 41612 connector, the BCCON-23 eliminates the point-to-point wiring harnesses required in older distributed I/O architectures, reducing installation labor and potential wiring-induced fault points.
• Extended environmental tolerance: The card’s operating range of 0–55 °C and IEC 60068-2-6 vibration compliance make it deployable in non-climate-controlled field enclosures and mobile plant equipment, expanding the addressable installation envelope beyond traditional control room environments.
• Diagnostic data logging: Communication error counters (CRC errors, timeout events, retry counts) are accessible via the ABB Control Builder engineering tool, providing quantitative data for predictive maintenance analysis and root-cause investigation of intermittent communication faults.

Quality Assurance & Global Logistics

Every BCCON-23 unit dispatched from our Xiamen, China facility undergoes a structured pre-shipment verification protocol. Functional power-on testing confirms that all three LED indicators respond correctly to simulated bus states. Communication loopback testing verifies that the BCC ASIC correctly encodes and decodes MasterBus 300 frames at rated speed. Visual inspection under 10× magnification checks solder joint integrity, component seating, and connector pin condition. Units that do not pass all test stages are quarantined and not listed for sale.

Packaging follows IEC 61340-5-1 ESD protection requirements: each card is placed in a conductive foam tray inside a metallized static-shielding bag, heat-sealed, and labeled with a humidity indicator card. The assembly is then packed in a double-wall corrugated carton with 50 mm foam cushioning on all six faces, rated for the vibration and drop conditions specified in ISTA 2A transit testing.

Logistics from Xiamen port to major industrial hubs: DHL Express to Europe (3–5 business days), FedEx International Priority to North America (4–6 business days), and sea freight consolidation for bulk orders to Southeast Asia and the Middle East. All shipments include a commercial invoice, packing list, and — upon request — a certificate of conformance and test report. Export classification and HS code documentation are prepared for each shipment to minimize customs clearance delays.

A 12-month warranty covers all units against manufacturing defects and functional failure under normal operating conditions. Warranty claims are processed within 5 business days of receipt of the returned unit, with replacement dispatch on the next available shipping day.

Contact Information

Email: [email protected]
WhatsApp: +86 18359268345
Web: siemensplc.com
Location: Xiamen, China
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