Siemens PLC sourcing desk · Multi-brand automation spares [email protected] +86 18359268345
Siemens In Stock OK

Siemens 6AV7240-0HC07-0PA0 Industrial Panel PC Motherboard – SIMATIC IPC477D

Request verified availability, condition, replacement risk review, packing options and courier lead time for 6AV7240-0HC07-0PA0.

Exact part6AV7240-0HC07-0PA0 RFQ auto-fillPart number attached Export packingDHL / FedEx / UPS Sales replyEmail or WhatsApp
BrandSiemens Part Number6AV7240-0HC07-0PA0 ConditionAvailability Check Lead TimeRFQ Confirmation DocumentsDatasheet / photos by RFQ ShippingExport packing available
Auto-filled RFQ 6AV7240-0HC07-0PA0

Click Request Quote and the part number is inserted into the inquiry form automatically.

Procurement Data

Key Product Information

Core fields for model confirmation and RFQ routing. Detailed product narrative remains below.

Brand
Siemens
Primary Part Number
6AV7240-0HC07-0PA0
Product Type
Industrial Panel PC Motherboard
Series / Family
SIMATIC
Country of Origin
DE
Catalog Category
HMI Panels
Warranty
12 months from dispatch date
Model confirmed for inquiry 6AV7240-0HC07-0PA0 Send quantity, destination and urgency. The RFQ form keeps this part number attached.
Request Quote
Product Overview

6AV7240-0HC07-0PA0 — Core Compute Assembly for SIMATIC IPC477D Panel PC Platforms

The Siemens order code 6AV7240-0HC07-0PA0 designates the primary motherboard assembly for the SIMATIC IPC477D series industrial panel PC. Within the IPC477D chassis, this board carries the full compute stack: processor socket, memory bus, chipset, storage controllers, display interface, and all field-facing I/O routing. It is not a peripheral sub-assembly — it is the functional core of the entire operator station. Facilities running IPC477D units in SCADA, DCS visualization, or machine HMI roles depend on this board’s uninterrupted operation for process continuity.

The IPC477D platform was positioned by Siemens in the mid-range industrial panel PC segment, targeting environments that require sustained 24/7 operation, IP65 front-panel sealing, and compatibility with WinCC, STEP 7, and TIA Portal visualization layers. The 6AV7240-0HC07-0PA0 board is the hardware substrate that makes those software commitments physically possible. Its Intel QM87 (Lynx Point) chipset provides the PCIe lanes, SATA controllers, and USB 3.0 host controllers that the IPC477D system architecture depends on.

For procurement engineers managing installed-base IPC477D fleets, sourcing a verified 6AV7240-0HC07-0PA0 replacement board is the most cost-effective path to restoring a failed unit — avoiding the capital expenditure and re-commissioning time associated with a full panel PC replacement. siemensplc.com maintains stock of this assembly and ships globally from Xiamen, China via DHL Express, FedEx International Priority, and UPS Worldwide.

Real-time Stock & RFQ: [email protected] | WhatsApp: +86 18359268345

Technical Parameters

Parameter Specification
Siemens Order Code 6AV7240-0HC07-0PA0
Compatible Platform SIMATIC IPC477D Industrial Panel PC
Component Classification Main Board / Motherboard Assembly
Processor Platform Intel Core i5-4400E / i7-4700EQ (Haswell, BGA1364)
Chipset Intel QM87 (Lynx Point), PCH architecture
Memory Interface DDR3L-1600, dual-channel SO-DIMM, max 16 GB
Storage Controllers SATA III (6 Gb/s) × 2; CFast socket (SATA II)
Display Interface Internal LVDS / eDP to integrated touch panel assembly
Ethernet Dual Intel I210-AT GbE PHY, RJ-45, 10/100/1000BASE-T
USB USB 3.0 × 2 (xHCI), USB 2.0 × 4 (EHCI)
Serial Interfaces RS-232 / RS-422 / RS-485 (COM1–COM2, software-selectable)
Expansion PCIe Mini Card × 1 (half-length); mSATA shared slot
Security TPM 1.2 (Infineon SLB 9635 TT1.2)
BIOS AMI UEFI with Siemens industrial extensions; Secure Boot capable
Validated OS WES7 SP1, WES2009, Windows 10 IoT Enterprise 2019 LTSC
Operating Temperature 0 °C to +50 °C (system-level, per IPC477D thermal spec)
Storage Temperature −20 °C to +60 °C
Relative Humidity 5–95% RH, non-condensing (IEC 60068-2-78)
Vibration Resistance 10–58 Hz: 0.075 mm; 58–500 Hz: 9.8 m/s² (IEC 60068-2-6)
Shock Resistance 150 m/s², 11 ms half-sine (IEC 60068-2-27)
EMC Emissions EN 55032 Class A; CE marked
EMC Immunity EN 55024; IEC 61000-4-2/3/4/5/6/8/11
System Power Input 24 V DC (18–30 V DC), via IPC477D PSU module
Country of Origin Germany
HS Code 8473.30
Warranty 12 months from dispatch date

Hardware Logical Analysis

The 6AV7240-0HC07-0PA0 board’s architecture reflects the design constraints of an embedded industrial compute platform rather than a general-purpose desktop motherboard. Several hardware decisions are worth examining in detail.

Dual-NIC Physical Isolation: The board carries two independent Intel I210-AT GbE controllers, each with a dedicated PCIe x1 lane from the QM87 PCH. This is not a cost-reduction measure — it is a deliberate topology that allows the IPC477D to maintain simultaneous, electrically isolated connections to an OT process network and a corporate IT network. In IEC 62443-compliant installations, this separation is a hardware-enforced boundary; no software bridge or VLAN can replicate the physical isolation that two independent MACs and PHYs provide.

Serial Port Signal Conditioning: The RS-232/422/485 COM ports are implemented with dedicated transceiver ICs (typically TI SN65HVD or equivalent) rather than USB-to-serial bridges. This matters in industrial environments because dedicated transceivers provide ±15 kV ESD protection on signal lines, hardware flow control without OS driver latency, and deterministic signal timing — characteristics that USB-to-serial adapters cannot guarantee. The RS-485 mode supports half-duplex multi-drop bus topologies used in Modbus RTU and PROFIBUS DP physical layers.

CFast Boot Media Architecture: The CFast socket is wired to a dedicated SATA II controller channel, separate from the primary SATA III ports used for data storage. This means the OS boot device and application data storage operate on independent SATA buses, eliminating bus contention during high-I/O periods. For WinCC installations with continuous historian writes, this separation measurably reduces boot-time I/O latency.

TPM 1.2 Integration: The Infineon SLB 9635 TT1.2 TPM is soldered directly to the board, not socketed. This prevents physical substitution attacks and ensures the TPM’s endorsement key hierarchy is permanently bound to this specific board assembly. For facilities using BitLocker or Siemens’ own BIOS-level security features, the soldered TPM is a prerequisite for hardware-rooted trust.

Thermal Design: The QM87 PCH and the BGA-mounted processor share a common heat spreader assembly that interfaces with the IPC477D chassis heatsink via a thermal interface pad. The board does not carry active cooling components — all heat rejection is handled at the chassis level. This fanless board design eliminates the primary mechanical failure mode in industrial compute platforms: fan bearing wear. Mean time between failures for fanless embedded boards in 40 °C ambient environments typically exceeds 100,000 hours.

EMC Shielding Architecture: The board layout places high-frequency switching nodes (DDR3L termination resistors, PCIe clock distribution) in the board interior, with ground planes on outer layers acting as Faraday shields. The chassis ground connection is made through multiple low-impedance points on the board edge connector, ensuring that chassis-level EMC shielding is electrically continuous with the board ground reference. This layout approach is consistent with EN 55032 Class A compliance without requiring external ferrite suppression on I/O cables.

System Integration Benefits

  • Zero-Modification Chassis Swap: The 6AV7240-0HC07-0PA0 board mates directly to the IPC477D chassis backplane connector, display cable, and I/O panel without any mechanical adaptation. BIOS settings are preserved in CMOS; no re-flashing is required if the replacement board carries the same firmware revision.
  • Deterministic Real-Time Response: The QM87 PCH’s interrupt routing architecture, combined with Siemens’ BIOS tuning (C-state management, SMI latency reduction), delivers sub-millisecond interrupt response times for time-critical HMI refresh cycles — a requirement for WinCC installations monitoring fast process variables.
  • Dual-Network Diagnostic Transparency: With two independent GbE interfaces, maintenance engineers can connect a diagnostic laptop to the IT-side NIC while the OT-side NIC remains live on the process network — enabling real-time diagnostics without process interruption.
  • Extended OS Lifecycle Alignment: Windows 10 IoT Enterprise 2019 LTSC support extends validated OS availability to January 2029, giving facilities a defined software lifecycle window for IPC477D units refreshed with this board.
  • PCIe Mini Card Expandability: The half-length PCIe Mini Card slot accepts standard industrial expansion modules: PROFIBUS DP master cards, PROFINET IO controllers, 4G/LTE modems, and IEEE 802.11ac WLAN adapters — all without chassis modification.
  • Secure Boot Chain: AMI UEFI Secure Boot, combined with the TPM 1.2, provides a hardware-verified boot chain from firmware to OS loader. This satisfies NERC CIP and IEC 62443-3-3 requirements for boot integrity verification in critical infrastructure installations.
  • Vibration-Rated Connector Retention: All board-to-chassis connectors use positive-locking mechanisms rated to the IEC 60068-2-6 vibration profile. In high-vibration environments (press lines, compressor rooms), this prevents intermittent contact failures that are the leading cause of unexplained IPC477D reboots.
  • WinCC / TIA Portal Native Compatibility: Because the board is a genuine Siemens assembly, WinCC Runtime and TIA Portal engineering software recognize the hardware platform without driver conflicts. Third-party or clone boards frequently trigger hardware fingerprint mismatches that invalidate WinCC licenses.

Quality Assurance & Global Logistics

Every 6AV7240-0HC07-0PA0 unit dispatched by siemensplc.com is a genuine Siemens-manufactured assembly. The Siemens order code and production date code are verified against the physical board markings and accompanying documentation before any unit is listed as available stock. Boards are stored in ESD-controlled environments (relative humidity 40–60%, temperature 18–25 °C) and packaged in anti-static bags with foam-padded outer cartons rated for international air freight handling.

Pre-shipment inspection covers: PCB surface condition (no corrosion, no mechanical damage to BGA packages or SMD components), connector pin integrity (all backplane and I/O connectors inspected under magnification), and label verification (Siemens part number, revision level, and CE marking confirmed present and legible). A 12-month warranty against manufacturing defects and functional failure is provided from the date of dispatch.

Logistics operations are based in Xiamen, China — a major international freight hub with direct DHL Express, FedEx International Priority, and UPS Worldwide services. Typical transit times: Southeast Asia 2–3 business days; Europe 3–5 business days; North America 4–6 business days. Export documentation (commercial invoice, packing list, certificate of origin) is prepared to customs standards for all destination markets. HS code 8473.30 is declared on all shipments. For urgent requirements, same-day dispatch is available for orders confirmed before 14:00 CST.

Contact Information

Email: [email protected]
WhatsApp: +86 18359268345
Web: siemensplc.com
Location: Xiamen, China
© 2026 siemensplc.com. All rights reserved.

Ready to quote

Send This Part Number to Sales

[email protected]
RFQ workflow

Confirmation Process

Quality workflow ->
01Model confirmation

We check the full part number, brand, series and visible nameplate information before quotation.

02Availability reply

Sales confirms stock path, condition option, quantity and realistic lead time for export dispatch.

03Packing & courier

DHL, FedEx, UPS or buyer courier arrangements can be reviewed with packing requirements.