Siemens 6ES7155-5MU00-0CN0 Interface Module – ET 200SP IM 155-5 PN MF
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Key Product Information
Core fields for model confirmation and RFQ routing. Detailed product narrative remains below.
- Brand
- Siemens
- Primary Part Number
- 6ES7155-5MU00-0CN0
- Product Type
- Interface Module
- Series / Family
- SIMATIC
- Country of Origin
- DE
- Catalog Category
- Communication
- Operating Temp.
- 0 °C to +60 °C (horizontal mounting)
- Warranty
- 12 months from shipment date
Siemens 6ES7155-5MU00-0CN0 IM 155-5 PN MF: Multi-Fieldbus Head Station for ET 200SP Distributed I/O Architecture
The 6ES7155-5MU00-0CN0 is the IM 155-5 PN MF (Multi-Fieldbus) interface module within the SIMATIC ET 200SP distributed I/O platform. As the head station of an ET 200SP station, this module governs all upstream fieldbus communication and downstream I/O module coordination across a single DIN-rail assembly. Its defining characteristic is simultaneous support for PROFINET IO and PROFIBUS DP within a single hardware footprint — a capability that directly addresses the protocol heterogeneity common in brownfield plant expansions and multi-vendor automation environments.
The module operates on a 24 V DC supply and interfaces with the ET 200SP backplane bus at a cycle rate that sustains deterministic data exchange with up to 64 downstream I/O modules per station. The backplane bus architecture uses a proprietary high-speed serial interface that decouples I/O scan cycles from fieldbus communication cycles, allowing the controller to maintain isochronous real-time (IRT) PROFINET timing even when the station is heavily loaded with analog and digital I/O modules. This architectural separation is critical in motion-coordinated applications where jitter tolerance is measured in microseconds.
From an EMC design standpoint, the module’s housing integrates shielded signal paths and galvanic isolation between the fieldbus interface and the internal backplane logic. The PROFINET port circuitry is isolated from the 24 V DC supply rail, preventing ground loop interference from propagating into the communication layer — a common failure mode in large cabinet installations with shared ground planes. The module carries IP20 protection, suitable for installation inside standard control enclosures with appropriate cable management.
Configuration and parameterization are performed entirely within SIMATIC STEP 7 / TIA Portal (V14 SP1 and above), with the module appearing as a standard ET 200SP head station in the hardware catalog. Firmware updates are delivered over PROFINET without requiring physical access to the module, reducing maintenance downtime in installations where the ET 200SP station is mounted in remote or elevated positions. The module supports PROFINET conformance class B (CC-B) and is compatible with the PROFINET IRT protocol for time-sensitive applications.
In PROFIBUS DP mode, the module acts as a DP slave, enabling legacy S7-300 and S7-400 controllers to address the ET 200SP station without infrastructure changes. This dual-protocol capability makes the 6ES7155-5MU00-0CN0 a practical migration bridge: engineers can retain existing PROFIBUS masters while expanding I/O capacity using the ET 200SP’s modular architecture, deferring full PROFINET migration to a later project phase.
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Technical Parameters
| Parameter | Value |
|---|---|
| MLFB / Order Number | 6ES7155-5MU00-0CN0 |
| Module Designation | IM 155-5 PN MF (Multi-Fieldbus) |
| Product Family | SIMATIC ET 200SP |
| Supply Voltage | 24 V DC (20.4 V – 28.8 V) |
| Current Consumption (typ.) | ≤ 350 mA at 24 V DC |
| Fieldbus Protocols | PROFINET IO (CC-B, IRT), PROFIBUS DP (slave) |
| PROFINET Ports | 2 × RJ45 (integrated 2-port switch) |
| Max. I/O Modules per Station | 64 |
| Backplane Bus Speed | High-speed serial (proprietary ET 200SP bus) |
| IRT Minimum Send Cycle | 250 µs |
| Operating Temperature | 0 °C to +60 °C (horizontal mounting) |
| Storage Temperature | −40 °C to +70 °C |
| Degree of Protection | IP20 (IEC 60529) |
| Mounting | DIN rail 35 mm (EN 60715) |
| Dimensions (W × H × D) | 30 mm × 117 mm × 74 mm |
| Weight | Approx. 260 g |
| EMC Compliance | CE, EN 61000-6-2, EN 61000-6-4 |
| Firmware Update Method | Over PROFINET (online, no physical access required) |
| TIA Portal Compatibility | V14 SP1 and above |
| Country of Origin | Germany |
| Warranty | 12 months from shipment date |
Hardware Logical Analysis
Backplane Bus Arbitration: The ET 200SP backplane bus operates as a master-slave serial bus where the IM 155-5 PN MF acts as the sole bus master. Each I/O module inserted into the station is assigned a slot address at power-up through an automatic enumeration sequence. The interface module polls each slot in a fixed cyclic order, collecting process image data and writing output values within a single bus cycle. This deterministic polling architecture eliminates bus contention and guarantees a bounded worst-case cycle time regardless of the number of modules installed — a property that RT-class PROFINET controllers depend on for predictable I/O response.
Dual-Protocol Communication Engine: The module’s communication ASIC implements PROFINET and PROFIBUS protocol stacks in separate firmware partitions. When operating in PROFINET mode, the integrated 2-port switch enables line topology wiring without external switches, reducing hardware cost and cabinet space. The switch supports LLDP (Link Layer Discovery Protocol) for automatic topology detection in TIA Portal’s network view. In PROFIBUS mode, the module’s DP slave stack handles GSD-based parameterization, allowing it to be addressed by any IEC 61158-compliant DP master without Siemens-specific tooling.
EMC and Isolation Architecture: The PROFINET PHY layer is transformer-coupled to the RJ45 connectors, providing 1.5 kV isolation between the network cable shield and the module’s internal ground. The 24 V DC input passes through an integrated transient suppressor rated for IEC 61000-4-5 surge immunity (Level 3: 2 kV line-to-earth). These design choices allow the module to operate reliably in environments with variable-frequency drives, contactors, and other high-di/dt switching loads sharing the same cabinet or cable tray infrastructure.
Hot-Swap I/O Module Support: The backplane bus logic implements a slot-presence detection circuit that monitors each module slot independently. When an I/O module is removed under power, the interface module immediately flags the affected slot in the PROFINET diagnostic data and continues normal operation on all remaining slots. Replacement modules are automatically re-parameterized from the stored configuration in the interface module’s non-volatile memory, restoring full station functionality without controller intervention or TIA Portal access.
System Integration Benefits
- Protocol bridge for brownfield projects: Connects new ET 200SP I/O expansions to existing PROFIBUS DP masters without replacing the controller or adding gateway hardware, preserving capital investment in legacy infrastructure.
- IRT-capable for motion applications: Supports isochronous real-time PROFINET with 250 µs minimum send cycles, enabling synchronized I/O updates for servo drive coordination and high-speed packaging machinery.
- Integrated 2-port switch eliminates external hardware: Line topology wiring is supported natively, reducing switch count, cabinet wiring complexity, and potential network failure points in distributed installations.
- Online firmware update via PROFINET: Firmware can be updated from TIA Portal without physical access to the module, a significant operational advantage in installations with elevated or remote mounting positions.
- Slot-level diagnostics with PROFINET transparency: Each I/O module slot reports individual diagnostic events (wire break, short circuit, parameter error) directly to the PROFINET controller, enabling fault isolation without manual inspection of the physical station.
- Scalable station architecture: Up to 64 I/O modules per station with mixed digital, analog, and technology module types, allowing a single ET 200SP station to replace multiple smaller remote I/O racks.
- Hot-swap I/O replacement without controller stop: Faulty I/O modules can be replaced during production without stopping the PLC program or the PROFINET communication cycle, minimizing unplanned downtime.
- Compact DIN-rail form factor: 30 mm module width allows high-density I/O configurations within standard 600 mm cabinet widths, reducing enclosure size and installation footprint compared to rack-based I/O systems.
- TIA Portal hardware catalog integration: Full GSD/GSDML support ensures the module appears correctly in TIA Portal’s device catalog with pre-configured parameter sets, reducing engineering time for new station configurations.
- Shared infrastructure with ET 200SP ecosystem: Compatible with the full range of ET 200SP BaseUnits, I/O modules, and server modules, allowing incremental expansion without replacing the head station or rewiring the backplane.
Quality Assurance & Global Logistics
Every 6ES7155-5MU00-0CN0 unit supplied by siemensplc.com is sourced through verified supply channels and undergoes a structured pre-shipment inspection covering label authenticity, housing integrity, connector condition, and firmware version verification. Units are stored in a climate-controlled warehouse in Xiamen, China, in ESD-safe packaging to prevent electrostatic discharge damage during storage and handling.
Shipments are dispatched from Xiamen via DHL Express, FedEx International Priority, or UPS Worldwide, with typical transit times of 3–5 business days to Europe and North America, and 2–4 business days to Southeast Asia. Each shipment includes a commercial invoice, packing list, and country-of-origin certificate to support customs clearance in all major import jurisdictions. For orders requiring specific documentation — including material safety data sheets, RoHS declarations, or inspection certificates — these are prepared and included at no additional charge upon request.
All units carry a 12-month warranty from the shipment date covering manufacturing defects and functional failures under normal operating conditions. Warranty claims are processed within 5 business days of receipt of the returned unit, with replacement or credit issued based on inspection findings. Express replacement shipments are available for critical production environments where downtime cost justifies expedited handling.
Contact Information
Email: [email protected]
WhatsApp: +86 18359268345
Web: siemensplc.com
Location: Xiamen, China
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